Labtech
Description: Teledyne Labtech is unique in offering a complete microelectronic assembly capability. This includes MMIC die-placement, wire bonding, ribbon bonding, wedge bonding and ball bonding.
printed circuit board manufacturer (17) copper coin (3) thermal heat dissipation pcbs (2) rf pcb fabrication (2) bonded waveguide (2) bonded metal wg (2) bonded structures (2) antenna fabrication (2) large format pcb (2) ifec antenna (2)
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Labtech