Description: Look to the Future through the highly advanced technology and science of nepes. nepes creates Hyper-connecting technologies to lead future businesses.
semiconductor (414) wlp (22) plp (19) nepes (3) wafer level package (2) fowlp (2) system in package (2) fan out-wlp/plp (2) flip-chip bumping (2) fan-out package (2)
현재 웹브라우저에서는 사이트가 정상적으로 표시되지 않을 수 있습니다. 여기를 클릭 하여 웹브라우저를 업그레이드 하세요.
Look to the Future through the highly advanced
technology and science of nepes.