Description: Conference on Electrical Performance of Electronic Packaging and
conference on electrical performance of electronic packaging and (1)
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.
We are happy to offer recording of the keynote talks from EPEPS 2023: Prof. Jose A. Cobos , "SURFACE Power Delivery, the Future of High-Performance Computing" Dr. Albert Ruehli , "Fifty Years of Partial Element Equivalent Circuit (PEEC) Enhancements"
Forwarding to EPEPS 2024 Toronto Homepage.