Description: Created in 1986, EGIDE designs, manufactures and sells hermetic packages for the protection and interconnection of a variety of electronic or photonic chips. These packages aim at ensuring the invulnerability of integrated electronic systems or sophisticated chips, which are therefore fragile and sensitive to thermal, atmospheric or magnetic conditions. Egide is a group with an international dimension, specialized in the manufacture of hermetic packages for sensitive electronic components. It operates in cu
egide (7) hermetic package (6) egide group (5) hermeticity (5) egide sa (4) egide usa (4) egide france (4) egide trappes (4) egide bollã¨ne (4) high frequency package (4)
Et quoniam inedia gravi adflictabantur, locum petivere Paleas nomvalido muro firmatum
Reducing the size (and weight) and increasing the power capabilities of the ICs onboard are constant care-abouts for engineers when designing a satellite. Packages need to support increased strength of the signal (higher frequency of the signal) and to dissipate a lot of heat as the power density, for instance for GaN components, increases. Egide has been invited to participate to the Heatpack proje ct for both the RF and LF packages in order to solve this complex equation and to develop the next generation
Increased security and controls on all lines The electrical rectifiers for each of the plating lines have been installed in an environmentally friendly area. This will prevent rectifier degradation and provide continuous operation with little or no maintenance. The individual plating lines have dedicated controllers that allow operators to review the various parameters such as temperature, solution level, conductivity, etc. Live data streamed from these controllers are accessed remotely with the use of comp
SANTIER, Inc. - Engineered Microelectronic Housings & Assemblies
EGIDE - Innovative packaging solutions
谱线科技
EGIDE - Innovative packaging solutions
EGIDE - Innovative packaging solutions