3D Power Electronics Integration and Manufacturing
The 3D Power Electronics Integration and Manufacturing Symposium, chaired by Raj Pulugurtha, FIU, was held February 1-3, 2023, and hosted by Florida International University (FIU) in Miami, Florida. The Symposium is financially sponsored by Power Source and Manufacturing Association (PSMA) and technically sponsored by the IEEE Electronic Packaging Society (EPS) and Florida International University. There were seven Partners/Exhibitors: Amkor Technology, FIU Biomedical Engineering, KEME – a YAGEO Company, Wo
3D-PEIM 2023 was a Hybrid Symposium with 95 in-person attendees/speakers and 5 virtual speakers. The attendees and contributors represented 8 countries from industry, academia, and government. They were treated to 3 information-packed days of 42 presentations (7 Plenary, 15 Keynote, and 20 invited/submitted) with 7 posters. The in-person attendees were treated to a lab tour of FIU Electrical Engineering.