brochure coming soon
We are recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology. Our goal is to enable our clients to compete more effectively by providing accurate, relevant, and timely information on technology trends and market developments. We provide strategic market analysis, competitive analysis, technology trends, and evaluation of product strategies in the areas of semiconductor packaging and assembly, electronics manufacturing, and materials. What set
The Advanced Packaging Update (4 issues per year) features special coverage of market and technology developments for BGAs, CSPs, stacked die CSPs, flip chip, and wafer level packages. Each issue includes new applications, developments in materials and assembly equipment, and new package constructions. Topics covered include: