Memory Con 2025
Samsung Catalyst Fund
Ventures | Micron Technology Inc.
Description: Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.
How is this possible? Because we have been at this for years, long before the industry standards were established. Inventing NuLink technology, incrementally improving it over the years, and taking it to volume production, have enabled us to achieve unprecedented characteristics.
“The economics of adopting a chiplet approach for IC design are tightly linked with the cost and maturity of the interconnect and packaging solution, as we demonstrated in our analysis. Eliyan’s chiplet interconnect technology will make multi-die approaches more attractive to chip suppliers whose designs must optimize on power and bandwidth vectors. This is especially the case for those in accelerated server computing applications, a market mainly served by datacenter GPU hardware, and which we see sustaini
Eliyan’s 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic substrate at unprecedented power, area, and latency, eliminating the need for complex Silicon Interposers in most applications.
Memory Con 2025
Samsung Catalyst Fund
Ventures | Micron Technology Inc.